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fiXtress®:

 

Automated Derating Analysis and MTBF Prediction Tool for Board & Multi-Board Design

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Key Features:

  • Comprehensive Electrical Stress Analysis: Performs in-depth component electrical stress derating analysis for single or multi-board systems.

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  • Temperature Prediction: Estimates PCB temperature rise due to IC heat generation, providing accurate data for stress derating and thermal management.
     

  • EOS Violation Detection: Detects all Electrical Over-Stress (EOS) violations with Pareto, over-stress, and over-design reports, and offers actionable recommendations.
     

  • MTBF Prediction: Provides a realistic estimate of Mean Time Between Failures (MTBF) based on real electrical and thermal stresses, with prediction capabilities for various standards.
     

  • Derating Graphs Manager: Includes ready-to-use derating standards and allows users to define custom derating guidelines to fit specific design needs.
     

  • Extensive Component Library: Features an AI-assisted library manager with auto-filled parameters and access to millions of components, streamlining component selection.
     

  • Automatic Reliability Data Integration: Seamlessly integrates reliability data with other RAMS analyses (FMECA, FTA, RBD, MTTR, and Logistics) for a comprehensive view of system reliability.
     

  • Powerful and User-Friendly: Utilizes AI-powered simulation modules for fast, precise, and reliable design analysis.
     

  • Seamless Integration: Functions as an add-on for any Electronic Design Automation (EDA) tool, compatible with popular E-CAD software for in-workflow analysis.
     

  • Overcoming SPICE Limitations: Analyzes large, complex PCBs with thousands of components, providing consistent results using public data sheets, and handling what SPICE tools may struggle with.

Benefits:

  • Gain System-wide Insights: Access comprehensive MTBF and life expectancy data, detect components with low reliability and identify critical overstressed parts.

  • Optimize Component Selection: Improve your component rating choices before layout, minimizing design iterations.

  • Conduct User-Friendly Analyses: Easily perform "what-if" analyses to adapt products for various environments.

  • Save Time: Automate processes and streamline workflows for significant time savings.

  • Enhance Durability: Ensure your electronics last longer and operate reliably.

How It Works:

  • Electrical Stress Analysis: fiXtress® conducts electrical stress analysis on components within your circuit design to perform component de-rating.

  • Reliability Prediction: It uses electrical stress input to predict MTBF, ensuring realistic MTBF and robust system reliability.

  • Thermal Optimization: Calculates board self-heating by considering component power dissipation and thermal resistance.

  • Comprehensive Data Storage: Stores component-rated values and thermal resistance data in an extensive library for thermal simulation and future use.

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A Closer Look at fiXtress®:

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Key Features

Parts Derating Analysis

  • Identifies over-stressed and over-designed components.

  • Utilizes an ECAD Plug-In for quick stress assignment.

  • Automates the process, optimizing component selection for reliability and cost-effectiveness.

Mini Thermal Anakysis – Average PCB Heating

  • Estimates average PCB temperature rise for accurate stress derating.

  • Enables optimal component placement before PCB layout.

  • Prevents overdesign or overstress with early thermal analysis.

Predict MTBF with Confidence

Our MTBF (Mean Time Between Failures) prediction capabilities adhere to the following industry standards:

• MIL-HDBK 217F2 / G: Provides reliability prediction guidelines for electronic equipment.
• MIL-HDBK 217F2 with VITA 51.1: An extension of MIL-HDBK 217F2, incorporating specific reliability predictions for electronic equipment as per VITA 51.1.
• FIDES 2009, FIDES 2022: Offers reliability methodologies for electronic systems. FIDES 2022 includes:
o More realistic failure rate values for modern components.
o New package categories for integrated circuits (ICs).
o Added classifications X5R and X7R for Type-2 ceramic capacitors.
• Models for plastic film capacitors.
• IEC 62380: Provides a universal model for reliability prediction of electronic components, PCBs, and equipment.
• IEC 61709: Details reference conditions for failure rates and stress models used in reliability predictions.
• Telcordia: Offers reliability prediction procedures specifically for electronic equipment.
• HDBK GJB299: The reliability prediction handbook for electronic equipment.
• SN 29500: Provides expected failure rate values and dependability metrics for components.
• HRD 5: The Handbook of Reliability Data for Electronic Components.
• NSWC: Handbook of reliability prediction procedures for mechanical equipment.

These standards ensure our predictions are based on the most accurate and comprehensive methodologies available.

Realistic MTBF Prediction

  • Provides a realistic estimate of the mean time to product failure.

  • Calculates accurate MTBF based on real electrical and thermal stresses.

  • Supports multiple industry standards for MTBF prediction.

  • Predicts Mean Time Between Failures (MTBF) using industry-standard methodologies (MIL-HDBK 217F2, Telcordia 3, FIDES 2022, IEC 62380, and more).

  • Easy import of product tree from CAD systems, quick access to component parameters, and part number libraries.

  • Comprehensive analysis, including failure rates, service life, and environmental considerations.

ECAD Plug-In

  • Serves as an add-on for major EDA tools like Altium, Mentor, OrCad.

  • Improves design robustness by detecting errors in the schematic phase.

  • Streamlines the design process and accelerates time to market.

benefits

Benefits

Ready-to-Use Derating Standards

  • Utilize predefined derating standards for quick analysis.

  • Define custom derating standards to meet specific requirements.

Unique Thermal Analysis

  • Estimates average temperature rise over the cold-plate for accurate stress derating.

  • Prevents unexpected breakdowns by keeping components within safe temperature limits.

Automated Processes

  • Automates component stress and derating analysis, saving valuable time.

  • Provides automated design error detection, optimizing component selection and reliability.

Comprehensive Error Detection

  • Detects all Electrical Over Stress (EOS) violations using Pareto, over-stress, and over-design reports.

  • Ensures adherence to derating guidelines for optimal component selection.

Seamless Integration

  • Works as an add-on for any EDA tool, offering a reliable crystal ball for electronic reliability.

  • Supports easy import/export of data from various sources, maintaining data traceability.

Industry Compliance

  • Supports a range of industry standards for derating and MTBF prediction.

  • Ensures your design follows best practices and industry guidelines.

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how it works

How fiXtress®  Works

Automated Derating Analysis

  • Automates the process of assessing stress levels for electronic components.

  • Utilizes Plug-Ins for major E-CADs (Altium, Mentor, OrCad) for easy Bill Of Materials (BOM) import.

  • Offers both semi-automatic stress assignment and logical stress calculations for an incomplete design.

  • Customizable derating guidelines based on industry standards or your company’s practice.

ECAD Integration

  • Serves as an add-on for Electronic Design Automation (EDA) tools like Altium, OrCad, and Mentor.

  • Improves design robustness by detecting errors during the schematic phase.

  • Streamlines the design process, accelerating time to market.

Early Thermal Assessment

  • Estimates board temperature increase before PCB layout, crucial for optimal component size selection.

  • Provides a Mini Thermal Analysis module, calculating average temperature rise over the cold-plate for accurate stress derating.

  • Enables effective design changes and prevents overdesign or overstress in the final product.

Comprehensive Reliability Solution:

  • Offers a suite of modules, including Component Derating, Realistic MTBF Prediction, Mini Thermal, Rapid Stress Assignment, ECAD Plug-In, and Cloud MTBF.

  • Allows users to define derating standards, detect EOS violations, and perform a failure Pareto analysis.

  • Drives reliability data automatically to all RAMS analyses, ensuring a thorough assessment for better design.

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